2D Thermal Mapping of a Microchip Using Nitrogen-Vacancy Centers in Diamond
By Owen, Maxwell
Introduction: Infrared sensors are currently the most popular method for industrial temperature mapping, but they have limitations when applied to complex materials and micrometer-level scales. For example, infrared wavelengths can range from 0.7μm to 20μm. In addition, factors such as the emissivity of a material, as well as changes in ambient temperature and humidity, drastically influence the accuracy of infrared sensors. Therefore, the aim of this project is to investigate an alternative option to thermal sensing that is more effective for mapping changes across microscopic electronic components. This project will utilize the nitrogen-vacancy (NV) center point defects inside a diamond plate to create a sensor capable of mapping thermal signatures across microchips on a micrometer scale. The goal of this project is to replicate the experimental procedure described by [1] and evaluate its accuracy by mapping heat signatures across resistors, capacitors, and transistors, gradually working up in complexity until finally mapping a microchip.
Intellectual Merit: The research advances the field of quantum thermal mapping by establishing a high-resolution, non-invasive wide-field imaging platform that uses the temperature-sensitive spins of NV centers in diamonds. By using optically detected magnetic resonance, our project will account for interference from separate magnetic-field effects, which have been major problems for NV thermo-mapping in the past. It also pushes the boundary of thermal sensing on a microscale, offering an alternative to traditional thermal mapping by providing highly precise localized temperature mapping without disrupting the electronics of the chip.
Broader Impact: The study helps the semiconductor and microelectronic industries by giving them a diagnostic tool to monitor thermal data in the new generation’s complex chips. By giving these industries a way of early detection of hot spots and other thermal stresses signifying structural issues, this imaging technology will help reduce error rates in microchip manufacturing and maintenance and improve the development of reliable electronic hardware. By integrating quantum mechanics, material science, and thermal engineering, it provides a foundation for future STEM professionals in the field of microelectronic technologies, which is a high priority for many nations around the world.